63319

Автор(ы): 

Автор(ов): 

9

Параметры публикации

Тип публикации: 

Доклад

Название: 

Classification of Wafer Maps Defect Based on Deep Learning Methods With Small Amount of Data

DOI: 

10.1109/EnT47717.2019.9030550

Наименование конференции: 

  • 6th International Conference on Engineering and Telecommunication (EnT-2019, Moscow)

Наименование источника: 

  • Proceedings of the 6th International Conference on Engineering and Telecommunication (EnT-2019, Moscow)

Город: 

  • Москва - Долгопрудный

Издательство: 

  • IEEE

Год издания: 

2019

Страницы: 

https://ieeexplore.ieee.org/abstract/document/9030550
Аннотация
The following topics are dealt with: learning (artificial intelligence); neural nets; wireless channels; object detection; radar signal processing; probability; modems; antenna radiation patterns; telecommunication network reliability; computational complexity.

Библиографическая ссылка: 

Захаров Э.А., Кудров М.А., Бухаров К.Д., Гришин Н.А., Семенкин В.Г., Махоткин Д.Р., Кривошеин Н.Е., Ложкина А., Базаев А. Classification of Wafer Maps Defect Based on Deep Learning Methods With Small Amount of Data / Proceedings of the 6th International Conference on Engineering and Telecommunication (EnT-2019, Moscow). Москва - Долгопрудный: IEEE, 2019. С. https://ieeexplore.ieee.org/abstract/document/9030550.